IEMT Conference 2022 39th International Electronics Manufacturing
Technology (IEMT)
39th International Electronics Manufacturing Technology (IEMT) 39th International Electronics Manufacturing
Technology (IEMT)
19th – 21st Oct 2022 Le Méridien Putrajaya
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39th International Electronics Manufacturing Technology (IEMT) Conference 2022

Venue: Le Méridien, Putrajaya, Malaysia

The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Electronics Packaging Society (EPS) Society of IEEE. The 39th International Electronics Manufacturing Technology (IEMT) Conference 2022 is organised by the IEEE EPS Malaysia Chapter with technical co-sponsorship from IEEE EPS Santa Clara Valley Chapter and IEEE Malaysia Section.

KEY Dates for Upcoming IEMT Conference 2022

1. Abstract Submission Due (Extension) : 15th Apr 2022
2. Abstract Acceptance Notification : 1st May 2022
3. Full Paper Submission : 15th July 2022
4. IEMT 2022 Conference : 19th – 21st Oct 2022

Our Sponsors

Our Speakers

who will speak

Prof Tan Chuan Seng
University Professor
Nanyang University, Singapore

Short Course – Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications

Prof Swami

Professor

Georgia Institute of Technology, USA

Short Course – Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their Interplay that will define the Future of Semiconductor Systems

Mr Azham

Senior Staff Engineer

NXP Semiconductors, Malaysia

Short Course – Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution

JaeYun Kim

Staff Engineer

NXP Semiconductors, South Korea

Short Course – Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution

Prof Fan Xuejun

University Professor

Lamar University, USA

Short Course – Reliability Mechanics Modeling and Simulation in Electronic Packaging – Thermo-Mechanics, Moisture, Dynamics and Electromigration

 

John H Lau

Professor

Unimicron Technology Corporation, Taiwan

Short Course – Fan-out Packaging and Chiplet Heterogeneous Integration

IEMT 2018 Highlights

Conference Highlight

Contact Us

IEMT Secretariat

E-mail: [email protected]