IEMT Conference 2022 39th International Electronics Manufacturing
Technology (IEMT)
39th International Electronics Manufacturing Technology (IEMT) 39th International Electronics Manufacturing
Technology (IEMT)
19th – 21st Oct 2022 Le Méridien Putrajaya
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39th International Electronics Manufacturing Technology (IEMT) Conference 2022

Venue: Le Méridien, Putrajaya, Malaysia

The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Electronics Packaging Society (EPS) Society of IEEE. The 39th International Electronics Manufacturing Technology (IEMT) Conference 2022 is organised by the IEEE EPS Malaysia Chapter with technical co-sponsorship from IEEE EPS Santa Clara Valley Chapter and IEEE Malaysia Section.

KEY Dates for Upcoming IEMT Conference 2022

1. Abstract Submission Due (Extension) : 15th Apr 2022
2. Abstract Acceptance Notification : 1st May 2022
3. Full Paper Submission : 15th July 2022
4. IEMT 2022 Conference : 19th – 21st Oct 2022

HRDF claimable under SBL

Our Sponsors

Our Speakers

who will speak

Prof Tan Chuan Seng
University Professor
Nanyang University, Singapore

Short Course – Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications

Prof Swami


Georgia Institute of Technology, USA

Short Course – Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their Interplay that will define the Future of Semiconductor Systems

Mr Azham

Senior Staff Engineer

NXP Semiconductors, Malaysia

Short Course – Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution

JaeYun Kim

Staff Engineer

NXP Semiconductors, South Korea

Short Course – Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution

Prof Fan Xuejun

University Professor

Lamar University, USA

Short Course – Reliability Mechanics Modeling and Simulation in Electronic Packaging – Thermo-Mechanics, Moisture, Dynamics and Electromigration

John H Lau


Unimicron Technology Corporation, Taiwan

Short Course – Fan-out Packaging and Chiplet Heterogeneous Integration

Prof. Chris Bailey

Director of Computational

Mechanics and Reliability Group

University of Greenwich

Keynote – Design Challenges for Advanced Packaging to enable a Smart and Energy Efficient World

Mr Chew CH

Senior Director


Keynote – Intelligent Power and Sensing Solutions for EV

Mr Subagaran (Suba) Letchumanan

Vice President

Manufacturing and Product


Intel Corporation (Penang) 

Keynote – Paradigm Shift in Testability and Diagnosis as Industry Moves to Heterogenous Product Integration

Dr.Veer Dhandapani

Senior Director of Product


NXP Semiconductors

Keynote – Semiconductors for Smart Connected Devices

Mr. Laurent Herard

Group VP – Head of Back End

Manufacturing and Technology R&D


Keynote – Packaging Innovation – A key enabler for a smart world

Bernhard Knot

Head of Backend Innovation Infineon

Keynote – Success Factors for innovative and reliable Package Solutions

E. Jan Vardaman

President and Founder of

TechSearch International, Inc

Keynote – Electronics Industry Growth Markets: Package Choices, Challenges, and Trend

Rolf Aschenbrenner

Deputy Director and Head of SIIT


Fraunhofer Institute (IZM)

Keynote – Heterogeneous Integration – A key enabler for a smart world

Prof. Hsiang-Chen Hsu

I-Shou University, Taiwan

Invited Papers – Characteristics and optimization fingerprint recognition on different materials using deep learning algorithm

Prof. Sung Yi

Portland State University, USA

Invited Papers – Machine Learning Framework for Predicting Reliability of Solder Joints

Rav Bilkhu

ON Semiconductor, Canada

Invited Papers – 2.5-3D Heterogeneous Packaging

Brian McGarvey

ON Semiconductor, Republic of Ireland

Invited Papers – Silicon Photomultipliers for LiDAR Applications

Rona Besprozvannaya

Rusoxide LLC, Russia

Invited Papers – Technology features оf Alumunium insulated metal baseplates for power electronics

Dr. Shalu Agarwal

Yole Developpement, France

Invited Papers – Evolution of Power Module Packaging Technologies

Roseanne Duca

STMicroelectronics (Ltd), Malta

Invited Papers – Modeling & Investigating Packaging Effects on Sensing Devices

Prof. Dr. Ulrike Grossner

Advanced Power Semiconductor

Laboratory (APS)

Invited Papers – From bare die to application: How packaging design choices influence the performance of power devices

Dr. Konstantin Kostov

RISE Research Institutes of Sweden

Invited Papers – Packaging of Discrete WBG Power Devices

Prof. Andrew Tay

National University of Singapore

Invited Papers – Thermal and Failure Analysis of Sub-Micron Devices Using Thermoreflectance Thermography

Johan Hamelink

Boschman Advanced Packaging Technology

Invited Papers – Assembly & Packaging Trends for Next Generation Power Modules

Dr. Alessio Greci

AMX Automatrix

Invited Papers – Ag/Cu Pressure Sintering Technology for Power Semiconductors

Dr. Eric Kuah

ASM Technology Singapore Pte. Ltd

Invited Papers – Characterization Challenges of Pressure Sintered HPE

Gyan Dutt

MacDermid Alpha Electronics Solutions

Invited Papers – Automotive Traction Module Attach by Silver Sintering – Process, Performance & Reliability

IEMT 2018 Highlights

Conference Highlight

Contact Us

IEMT Secretariat

E-mail: [email protected]