IEEE IEMT 2022 invites you to submit your work to the 39th IEMT 2022 that will be held in Le Meridian, Putrajaya, Malaysia. It is an international event organized by the IEEE-EPS, Malaysia Chapter, with co-sponsorship from IEEE Electronic Packaging Society (EPS). The IEMT typically attracts more than 400 attendees over the world. The last IEMT 2018 (Melaka, Malaysia) hosted 600 attendees, with 100 accepted papers and interactive presentation featured in 16 sessions. IEMT 2022 welcomes papers covering electronics packaging technology in diverse semiconductor market. This segment includes telecommunication, data center, automotive, EV, healthcare, aerospace, defense and others.
Abstract should include original and previously unpublished, non-confidential and non-commercial information on new developments, technology and knowledge in the areas including, but not limited to those given below.
Abstract are limited to 250-750 words that describes the scope, content, and key points of your proposed paper. Additional details on how to submit abstract electronically can be found on the ECTC website under the ‘Author” tab. Abstracts must be received by March 15th, 2022. All abstracts must be submitted electronically at https://in.explara.com/submix/iemt-2022.
If you have any questions, contact:
E-mail: [email protected]
Conference Web: https://www.iemt.com.my/