The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Electronic Packaging Society (EPS) of IEEE. IEMT 2014 is being organized by the IEEE EPS Malaysia Chapter with co-sponsorship from IEEE Santa Clara Valley Chapter.
IEEE EPS Malaysia has successfully organized the 36th International Electronics Manufacturing Technology (IEMT) at the Renaissance Johor Baru Hotel in the state of Johor from 11 to 13th Nov 2014. IEMT is the flagship conference from IEEE Santa Clara which EPS Malaysia now hosts once every two years, alternating between Santa Clara and Malaysia.
This year, IEMT 2014 had a total of 9 keynotes, 5 short-courses and 4 parallel sessions (> 80 technical papers & posters) covering latest technology and industry trend in electronics packaging and manufacturing technology. There was a panelist forum entitled “IoT: Roles of Packaging and Industry Trends” that touched on packaging cost, investment comparison of 18” wafer versus Panel/FOWLP, SiP versus SoC, and low-cost innovation.
Our keynote and short-course speakers were Prof. CP Wong (Georgia Tech/ City University of Hong Kong), Prof. Andrew Tay (National University of Singapore), Prof. Simon Ang (University of Arkansas), Dr. Rolf Aschenbrenner (Fraunhofer Institute for Reliability and Micro-integration Berlin (IZM), Dr. John Xie (Altera), Dr. Knoblauch Andreas (Infineon), Dr. Xavier Baraton (ST Microelectronics), Dr. Koh Byeong Cheon (formerly Samsung), Shubada (Intel), Dr. Sandeep (Intel), Mr. YK Sow (Intel) and Christian Burmer (Infineon).
IEMT 2014 was well received and attended by the local and international participants, 20 exhibitors and 50 companies with total participants of more 400 people. We are looking to the next IEMT in 2016 at the beautiful island of Penang, Malaysia.
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