| Date | Time | Type | Speaker | Speaker Affiliation | Topics |
|---|---|---|---|---|---|
| 19th October 2022 (Wednesday) | 8:30am to 12:30pm | Session 1: Half-Day | Prof Tan Chuan Seng | Nanyang University | Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications |
| 19th October 2022 (Wednesday) | 1:30am to 5:30pm | Session 1: Half-Day | Prof Swami | Georgia Institute of Technology | Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their Interplay that will define the Future of Semiconductor Systems |
| 19th October 2022 (Wednesday) | 8:30am to 5:30pm | Session 2: Full Day | Mr Azham JaeYun Kim |
NXP Semiconductors | Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution |
| 19th October 2022 (Wednesday) | 8:30am to 5:30pm | Session 3: Full Day | Prof Fan Xuejun | Lamar University | Reliability Mechanics Modeling and Simulation in Electronic Packaging – Thermo-Mechanics, Moisture, Dynamics and Electromigration |
| 19th October 2022 (Wednesday) | 8:30am to 5:30pm | Session 4: Full Day | John H Lau | Unimicron Technology Corporation | Fan-out Packaging and Chiplet Heterogeneous Integration |
40th International Electronics Manufacturing Technology (IEMT) Conference 2024