| Time | Short Courses | Venue |
|---|---|---|
| Session 1: Half Day 8:30 am – 12:30 pm |
Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications Prof Tan Chuan Seng (University Professor), Nanyang University |
TBD |
| Session 1: Half-Day 1:30 pm – 5:30 pm |
Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their interplay that will define the future of Semiconductor Systems Prof Swami (Professor), Georgia Institute of Technology |
TBD |
| Session 2: Full Day 8:30 am – 5:30 pm |
Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution Mr Azham (Senior Staff Engineer), JaeYun Kim (Staff Engineer), NXP Semiconductors |
TBD |
| Session 3: Full Day 8:30 am – 5:30 pm |
Reliability Mechanics Modeling and Simulation in Electronic Packaging –Thermo-Mechanics, Moisture, Dynamics and Electromigration Prof Fan Xuejun (University Professor), Lamar University |
TBD |
| Session 4: Full Day 8:30 am – 5:30 pm |
Fan-out Packaging and Chiplet Heterogeneous Integration John H Lau (Professor), Unimicron Technology Corporation |
TBD |
With the COVID-19 situation peaking in most parts of the world and the recovery may take longer than expected, the organizing committee has decided to postpone the IEMT 2020 conference to next year (Sept 2021).
Please refer to same webpage for further conference information and updates. We looking forward to see you next year at the conference!