Agenda

DAY 1: WEDNESDAY, OCTOBER 19, 2022

Time Short Courses Venue
Session 1: Half Day
8:30 am – 12:30 pm
Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications
Prof Tan Chuan Seng (University Professor), Nanyang University
TBD
Session 1: Half-Day
1:30 pm – 5:30 pm
Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their interplay that will define the future of Semiconductor Systems
Prof Swami (Professor), Georgia Institute of Technology
TBD
Session 2: Full Day
8:30 am – 5:30 pm
Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution
Mr Azham (Senior Staff Engineer), JaeYun Kim (Staff Engineer), NXP Semiconductors
TBD
Session 3: Full Day
8:30 am – 5:30 pm
Reliability Mechanics Modeling and Simulation in Electronic Packaging –Thermo-Mechanics, Moisture, Dynamics and Electromigration
Prof Fan Xuejun (University Professor), Lamar University
TBD
Session 4: Full Day
8:30 am – 5:30 pm
Fan-out Packaging and Chiplet Heterogeneous Integration
John H Lau (Professor), Unimicron Technology Corporation
TBD