Time | Short Courses | Venue |
---|---|---|
Session 1: Half Day 8:30 am – 12:30 pm |
Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications Prof Tan Chuan Seng (University Professor), Nanyang University |
TBD |
Session 1: Half-Day 1:30 pm – 5:30 pm |
Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their interplay that will define the future of Semiconductor Systems Prof Swami (Professor), Georgia Institute of Technology |
TBD |
Session 2: Full Day 8:30 am – 5:30 pm |
Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution Mr Azham (Senior Staff Engineer), JaeYun Kim (Staff Engineer), NXP Semiconductors |
TBD |
Session 3: Full Day 8:30 am – 5:30 pm |
Reliability Mechanics Modeling and Simulation in Electronic Packaging –Thermo-Mechanics, Moisture, Dynamics and Electromigration Prof Fan Xuejun (University Professor), Lamar University |
TBD |
Session 4: Full Day 8:30 am – 5:30 pm |
Fan-out Packaging and Chiplet Heterogeneous Integration John H Lau (Professor), Unimicron Technology Corporation |
TBD |